专利名称：HEAT SINK AND A METHOD OF FIXING THE
SAME
发明人：Aravind Nayak申请号：US14008064申请日：20110811
公开号：US20140014309A1公开日：20140116
专利附图：
摘要：The invention relates to a heat sink and a method of fixing the same. In oneembodiment this is accomplished by a method for bonding a heat sink and an electronicdevice together, wherein the heat sink including a base member and a heat radiating
portion the method comprising milling the base member in the midst of the heat sink ofa predetermined depth, cleaning the milled surface of the heat sink with an activator,filling the milled surface of the heat sink with an adhesive for bonding with the electronicdevice and placing the heat sink on the electronic device and applying force for apredetermined amount of time period.
申请人：Aravind Nayak
地址：Bangalore IN
国籍：IN
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